SC6-TANGO

CompactPCI© Serial CPU Card ● Low Power Intel® Atom™ SoC (Apollo Lake APL-I E39xx)

The SC6-TANGO is a low power CompactPCI® Serial CPU board, based on an Intel® Atom® 39xx-series System-on-Chip processor (Apollo Lake APL-I).

The SC6-TANGO front panel is provided with two Gigabit Ethernet jacks (option M12-X), two USB 3.0 receptacles, and two DisplayPort connectors. The board is equipped with 8GB directly soldered DDR3L ECC RAM, and a CFast™ card socket as on-board SATA SSD mass storage solution.

Optionally available is an on-board 64GByte e•MMC flash memory chip. Further more, low profile SATA SSD mezzanine modules are available as additional on-board mass storage solution (4HP assembly), and also a multi-function side card (8HP). The SC6-TANGO backplane connectors comply with the CompactPCI® Serial system board specification, suitable for small system expansion via 4 x PCIe® and 2 x GbE.

Downloads & Ressources

Documents

Application Notes

Power Event (Power Down)

General Information

CompactPCI® Serial

Firmware

Firmware Update

Drivers

Intel® Driver & Support Assistant

Tools

Technical Library

Expansion Modules

Low Profile Mezzanine Modules

C47

C48

S20

Side Cards

PCU

C44

Specifications

General

CompactPCI® Serial (PICMG® CPCI-S.0) System Slot Controller
Form factor single size Eurocard (board dimensions 100x160mm²)
Mounting height 3U
Front panel width 4HP (8HP/12HP assembly with optional mezzanine side card)
Front panel I/O connectors for typical system configuration (2 x USB3, 2 x DisplayPort, 2 x GbE)
Backplane communication via CompactPCI® Serial connectors
On-board SATA 6G mezzanine expansion option for mass storage modules or side cards
Side cards and low profile mass storage modules available as COTS and also as custom specific

Processor

Intel® Apollo Lake (APL-I) SoC E39xx Series
x7-E3950 • 4 Cores • 1.6GHz (TB 2.0GHz) • 12W TDP/cTDP • 400/650MHz graphics • 2MB LLC
x5-E3940 • 4 Cores • 1.6GHz (TB 1.8GHz) • 9W TDP/cTDP • 400/600MHz graphics • 2MB LLC
x5-E3930 • 2 Cores • 1.3GHz (TB 1.8GHz) • 6W TDP/cTDP • 400/550MHz graphics • 2MB LLC
Graphics Burst, CPU Burst, Intel® Speedstep®
Intel® Virtualization Technology (Intel® VT-x / VT-d)
Intel® Trusted Execution Engine (Intel® TXE) 3.0

Firmware

Main Memory

Mass Storage

On-board CFast™ Card socket (SATA based CompactFlash)
Option front I/O Micro SD Card socket (SDHC, SDXC), available on request
SPI Flash 128Mbit (UEFI firmware and customer application data)
Option e•MMC (embedded MMC 5.0 64GByte soldered)
Option low profile mezzanine card C41-CFAST (secondary CFast™ card socket) via P-HSE connector
Option low profile mezzanine card C42-SATA (1.8-inch Micro SATA SSD socket) via P-HSE connector
Option low profile mezzanine card C47-MSATA (dual mSATA SSD module sockets) via P-HSE connector
Option low profile mezzanine card C48-M2 (dual M.2 SATA SSD module sockets) via P-HSE connector
Option 8HP assembly side card PCU-UPTEMPO (dual M.2 SATA SSD module sockets) via P-HSE connector
Option 8HP assembly side card C44-SATA (2.5-inch SATA SSD/HDD) via P-HSE connector
Option custom specific mezzanine board design on request

Graphics

Networking

Four networking interface controllers (NIC), 1000BASE-T, 100BASE-TX, 10BASE-T connections
Intel® I210-IT -40°C to +85°C operating temperature GbE controllers w. integrated PHY
IPv4/IPv6 checksum offload, 9.5KB Jumbo Frame support, EEE Energy Efficient Ethernet
IEEE 802.1Qav Audio-Video-Bridging (AVB) enhancements for time-sensivitive streams
IEEE 1588 and 802.1AS packets hardware-based time stamping for high-precision time synchronization
Two GbE ports via RJ45 front panel jacks (option 2 x M12-X with mezzanine module P01)
Two GbE ports via backplane connector P6

APL SoC I/O Usage

4 x PCIe® Gen2 to backplane connectors, by default configured as 4 x 1 links
1 x PCIe® Gen2 to PCIe® switch PI7C9X2G606PR 1:5 lanes (to on-board PCIe® devices)
1 x SATA 6G to on-board CFast™ SSD card socket – can be used as mass storage and boot device
1 x SATA 6G to mezzanine expansion connector P-HSE
e•MMC I/F 400MByte/s (HS400) to embedded MMC 5.0 64GByte (ordering option, mass storage device)
2 x USB 3.0 to front panel connectors
2 x DisplayPort to front panel connectors
SDIO (Micro SD Card) front panel slot (option, available on request)
4 x USB2 to J2 backplane connector
LPC, Audio, I2C, 2 x USB2 to mezzanine expansion connector P-EXP
LPC to TPM 2.0 module

Additional Building Blocks

Security

Front Panel I/O (4HP)

Front Panel I/O (8HP)

CompactPCI® Serial Backplane Resources

Local Expansion

Mezzanine side card connectors for optional local expansion
P-EXP – LPC, Audio, 2 x USB2, I2C (from APL SoC)
P-HSE – 1 x SATA 6G (HSE port 1, from APL SoC)
P-HSE – 2 x SATA 6G (HSE ports 2 and 3, from PCIe® to SATA controller 88SE9170)
P-HSE – 1 x PCIe® (HSE port 1, from APL SoC, replaces SATA channel, manufacturing option)

4HP Low profile mezzanine module options (to be ordered separately)
CFast™ Card with C41-CFAST mezzanine module
SATA 1.8-Inch Solid State Drive with C42-SATA mezzanine module
Dual mSATA SSD with C47-MSATA mezzanine module
Dual M.2/NGFF SATA SSD 2230 – 2280 size with C48-M2 mezzanine module
M.2 PCIe® SSD S20-NVME mezzanine module
Custom specific module design

8HP Mezzanine side card option (to be ordered separately)
PCU-UPTEMPO side board w. 2 x M.2 SATA sockets & front I/O
2.5-inch SATA SSD/HDD available with C44-SATA
Custom specific side card design

Environmental & Regulatory

Designed & manufactured in Germany
ISO 9001 certified quality management
Long term availability
Rugged solution
Coating, sealing, underfilling on request
Lifetime application support
RoHS compliant 2002/95/EC
EC Regulatory EN55024, EN55032, EN62368-1
Operating temperature -40°C to +85°C (industrial temperature range)
Storage Temperature: -40°C to +85°C, max. Gradient 5°C/min
Humidity 5% … 95% RH non Condensing
Altitude -300m … +3000m
Shock 15g 0.33ms, 6g 6ms
Vibration 1g 5-2000Hz
MTBF 22.0 years

RT OS Board Support Packages & Driver

Applications

Simplified Block Diagram

Contact Us

+49 (0)2381/6890-0

SC6-TANGO

CompactPCI© Serial CPU Card ● Low Power Intel® Atom™ SoC (Apollo Lake APL-I E39xx)

EKF Elektronik GmbH

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